HDPRO

Ultra-Precise Compact
Laser Processing Platform

ULTRA-PRECISE Compact Laser Processing Platform

HDPRO is an ultra-compact, high-performance micromachining platform engineered for nanosecond and femtosecond laser applications demanding sub-micron precision.


Designed for industrial and research environments, it delivers nanometric resolution and laser spot sizes down to 2μm.
HDPRO is a complete laboratory for laser applications “All in the box” with advanced components that ensures best performance and flexibility.

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FEATURES

  • Up to 8 times smaller and lighter than equivalent laser processing machines
  • Integrated High Power nanosecond or femtosecond laser down to 2 μm spot sizes
  • 20-bit integrated 2D Scanner
  • Co-Lineal high resolution vision system and laser autofocus
  • High precision 6 axis stages control (X-Y-Z-Rot-Tip-Tilt)
  • Integrated 3D optical profiler with 1 nm vertical resolution
Industrial-level accuracy in a compact footprint
Integrated 3D surface profiling
Multi-laser source compatibility

HDPRO developed for high accuracy applications

  • Process volume of 100 mm x 100 mm x 5mm (triplicated)
  • Positioning resolution down to 100 nm
  • Tip-Tilt automatic correction to ensure plane process minimizing errors
  • Hybrid processing: Galvo & Fixed lens processing mixed with repeatability < 1 μm
  • Co-lineal process high resolution vision with sub-micron resolution ensures alignment errors < 1 μm
  • 3D analysis integrated tool: Confocal-interferometer head capable to scan full process volume with 1 nm resolution in Z.
  • Efficient vibration isolation design
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Configured with multiple laser sources options:

  • Femtosecond Double wavelength: 10W/5W (IR/VIS) femtosecond laser source
  • Femtosecond UV up to 10 W
  • Nanosecond Double wavelength: up to 3W (VIS & UV)
  • Single wavelength femtosecond or nanosecond

And multiple Focal objectives:

  • 5X, 10X and 20X LWD Objectives.
  • 32 mm to 55 mm Telecentric lens

LASER CONFIGURATIONS

TABLAS_MAQUINAS_HDPRO

KEY BENEFITS