Glass Micro-Processing & 3D Structuring
Ultrafast laser processing enables true 3D micro-structuring inside transparent materials, going far beyond surface patterning. Using ultra-short pulses, the glass matrix is locally modified with sub-micron precision and subsequently removed through chemical etching (Selective Laser Etching, SLE), or directly ablated for single-step, maskless micro-drilling or micro-patterning.
We have proven in-house experience in SLE of transparent materials, including through-glass vias (TGVs), channels, diverse cuts, and complex internal geometries, as well as direct laser ablation micro-drilling for rapid prototyping. This dual-process capability allows users to choose between maximum 3D design freedom and surface quality (SLE), or speed and simplicity (direct ablation).
Typical Features & Process Capabilities
KEY BENEFITS
KEY APPLICATION MARKETS
Photonics & optoelectronics
Fabrication of glass-based components for photonic integrated circuits (PICs), optical interposers, waveguide routing, and advanced packaging, including through-glass vias and micro-optical features.
Microfluidics & lab-on-a-chip
True 3D microchannels, mixers, and cavities inside glass substrates for chemical analysis, diagnostics, and life-science research, benefiting from optical transparency and chemical robustness.
Advanced electronics & interposers
Through-glass vias (TGVs), high-aspect-ratio features, and precision openings for next-generation packaging, heterogeneous integration, and RF applications.
Medical & bioengineering devices
Glass micro-structures for diagnostic cartridges, implantable or disposable devices, and bio-analytical platforms where cleanliness, chemical stability, and optical access are essential.
R&D, prototyping & process development
Research centers, pilot lines, and industrial R&D teams developing new glass-based devices and processes, leveraging both SLE and direct ablation to iterate rapidly and scale over time.
Why HDPRO?
LASING HDPRO platform is an excellent fit for advanced glass micro-processing applications such as Selective Laser Etching (SLE), through-glass vias, and complex 3D geometries.
HDPRO combines ultrafast laser compatibility with a highly stable mechanical and optical architecture, enabling accurate 3D laser writing inside transparent materials as well as repeatable direct ablation on glass surfaces. Full control over laser parameters and scan strategies (such as slicing, hatching, polarization, and focus management) allows users to finely tune SLE contrast, etch selectivity, and ablation quality across different glass types and thicknesses.
A key differentiator of the platform is the native integration of high-resolution 3D metrology, enabling direct measurement of feature depth, surface quality, and dimensional accuracy on the same system used for processing. In addition, HDPRO is prepared for advanced beam delivery schemes, including elongated focal volumes, supporting high-aspect-ratio SLE, depth-uniform modification, and efficient glass cleaving as processes evolve.
