Ultra-Precise Laser Cutting & Dicing
Ultra-precise laser cutting and dicing enable the fabrication of high-quality components with micron-level accuracy, exceptional edge quality, and minimal thermal impact. Using ultrafast laser technology, complex geometries can be created directly from CAD data without mechanical contact, tooling, or material-induced stress.
The process is suitable for a wide range of materials, including metals, glass, ceramics, semiconductors, and functional thin films. From wafer dicing and glass separation to precision metal cutting and thin-film patterning, laser-based processing provides a flexible and highly controllable solution for research, prototyping, and advanced manufacturing applications.
KEY BENEFITS
Why LABCORE?
The LASING LABCORE platform is specifically designed to address the demanding requirements of ultra-precise laser cutting and dicing. Its modular architecture supports the integration of multiple laser technologies and wavelengths within a single system, allowing process optimization for materials ranging from metals and glass to semiconductors, ceramics, and functional thin films.
By combining high-accuracy motion control, advanced machine vision, and fully integrated software, LABCORE enables the production of complex micro-scale features with outstanding precision and repeatability. Whether for wafer dicing, glass cutting, thin-film patterning, or precision component manufacturing, the platform provides the flexibility and performance required for both R&D and industrial-scale process development.
